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DMEA- **** LVDT IC ( Re- Spin) - See attached justification.
Procurement of production assembly and testing for the **** Linear Variable Differential Transformer ( LVDT) Integrated Circuit ( IC) respin The contractor shall perform wafer dicing, packaging, and screening for the **** LVDT IC respin in accordance with DMEA PWS ****.
Environmental Testing of Electronic Assemblies Blanket Purchase Agreement ( BPA) - Procurement of Environmental Testing of Electronic Assemblies Blanket Purchase Agreement ( BPA). See attached combined synopsis and solicitation, Performance Work Statement ( PWS), proposal instructions and evaluation criteria, and draft BPA agreeme
Environmental testing of electronics products
Bid Close Date:
MSES IDIQ J& A - Justification and Approval ( J& A) to increase the contract ceiling for Manufacturing Sustainment & Engineering Support ( MSES) IDIQ.
Multiple Award PCB Fab and Assembly BPAs 2026- 2030 - Re- solicitation of **** DMEA&# 39; s mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, t
electrical and electronic assemblies, boards, cards, and associated hardware sixty 60 grimwing units and sixty 60 direwing units
Bid Close Date:
Microelectronics Systems Integration Indefinite Delivery/Indefinite Quantity ( IDIQ) - This requirement is for a Single Award IDIQ focused on Microelectronics Systems Integration, which encompasses the fabrication, component procurement, and assembly of microelectronic systems. See attachments for details.
microelectronics systems integration manufacturing service contract enabling a turn key solution for full turnkey microelectronicsystems integration tasks including pcb fabrication, component procurement, pcb assembly, cca cleaning andcoating, pcbccasystem reworkrepair, mechanical component manufacturing, , automated ccasystemtesting, burninenvironmental screening, and microelectronics system integrationassembly.
Bid Close Date:
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