National Aeronautics And Space Administration- National Aeronautics And Space Administration- Nasa Shared Services Center
Packaging Support Engineer - SEE THE ATTACHED RFQ AND SOW.
requirements the vendor shall support the design, flipchip bonding, packaging, and analysis of test articles in goddard space flight center cleanrooms release microlens array from its carrier wafer after antireflection layer deposition. clean the bonding surfaces on both microlens and detector chips using a microscope and singlehair brush to remove all particles greater than 2 microns diameter from the delicate devices. apply adhesive, align parts to 3 m, and make the adhesive bond with set fc300 high precision die flip chip bonder using set proprietary gui software version **** or earlier. after hybridization, assess bond quality by attaching standoffs to the completed microlensdetector hybrids, taking infrared images through the silicon die with a flir **** mwir infrared microscope, and measuring surface profiles with a zygo newview **** white light interferometer. package the completed hybrid in a custom protective container for shipment to test facilities at the jet propulsion lab. establish the
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