National Aeronautics And Space Administration- National Aeronautics And Space Administration- Nasa Shared Services Center
Silicon Wafer Ball Bonder - NASA/NSSC has a requirement for a Silicon Wafer Ball Bonder. See the attached SOW and capability statement for further details.
to provide ball bonder to nasa hb05 tpt manual wire bonder, wedge ball bondersku: hb05 simple conversion from wedge to ball bonding tool and program 4. 3 tft display multidial controller separate manual xy stage control manual zlever work area: 200mm round base plate 17 75u m wedge bonding 17 50um ball bonding 25 x 250um ribbon bonding max 2 wire spool holder 20 bonding parameters storage capacity motorized clamping mechanism able to feed wire updown electronic wire clamp for precise tail length control electronic ball size control 63. 3 khz pll controlled transducer 0 10 watt ultrasonic power programmable bond time 01 sec. force 200cn max. builtin heater stage controller2 microscope leica lvesta 3, 6. 3x 11oxsku: h10 dual led llluminator included 2 x ocular ****, leica microscope holder3 adjustable height heater stage 0 60mm, 250csku: h26 18mm vertical travel mechanical clamping and vacuum4 bond starter kit for hb05 wedge ball bonder goldsku: h692gincludes: 3 pc h6021 wedge tool for 25u m gold wire3 pc h612
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