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2027 Milling and Resurfacing Project
Milling and resurfacing Maintenance of traffic, temporary traffic control, lane closures, erosion and sedimentation control, existing paver and concrete header curb demolition, milling, resurfacing, signage, pavement markings, patterned pavement installation
Bid Close Date:
BU- ****- 24 Student Rm & Stairwell Flooring - Remove existing asbestos tile, base, & mastic. Provide and install Amtico vinyl wood patterned flooring, rubber cove base, & rubber reducer strips according to specifications that follow student room
Bid Close Date:
PARKER ROAD AND HILLTOP ROAD INTERSECTION IMPROVEMENTS ( CIP 23- 027) The project consists of intersection improvements at Parker Road and Hilltop Road. The scope of the work consists of but not limited to removal of concrete pavement ( 2, 400 SY), unclassified excavation ( 1, 600 CY), aggregate base course ( 1, 300 CY), concrete pavement ( 3, 500 SY). In addition, the associated traffic signal work, pavement markings, traffic and erosion control.
Intersection improvements Removal of concrete pavement ( 2, 400 sy), unclassified excavation ( 1, 600 cy), aggregate base course ( 1, 300 cy), concrete pavement ( 3, 500 sy), traffic signal work, pavement markings, traffic and erosion control.
Bid Close Date:
Lot 54: Median cover material ( 4- inch patterned concrete) ( colored)
Lot 1: Clearing and grubbing
Lot 2: Removal of tree
Lot 3: Removal of inlet
Lot 4: Removal of pipe ( special)
Lot 5: Removal of concrete median cover material
Lot 6: Removal of sidewalk
Lot 7: Removal of curb and gutter
Lot 8: Removal of concrete curb ramp
Lot 9: Removal of concrete pavement
Lot 10: Removal of asphalt mat
Lot 11: Removal of pavement marking ( special)
Lot 12: Removal of ground sign
Lot 13: Removal of sign panel
Lot 14: Unclassified excavation ( cip)
Lot 15: Potholing
Lot 16: Concrete washout area
Lot 17: Construction fence
Lot 18: Debris and trash control
Lot 19: Inlet protection, curb on sump
Lot 20: Inlet protection, for area inlets in pavement
Lot 21: Inlet protection, curb on grade
Lot 22: Portable toilet protection
Lot 23: Rock sock
Lot 24: Seeding, mulching, and crimping
Lot 25: Stabilized staging area
Lot 26: Vehicle tracking control
Lot 27: Reset ground sign
Lot 28: Reset sign panel
Lot 29: Reset traffic signal head
Lot 30: Adjust manhole
Lot 31: Modify structure
Lot 32: Rock mulch ( weed free)
Lot 33: Aggregrate base course ( class 6)
Lot 34: Reconditioning
Lot 35: Hot mix asphalt ( patching)( asphalt)
Lot 36: Concrete pavement ( 8. 5 inch)( fast track)
Lot 37: Concrete pavement ( 9. 5 inch)( fast track)
Lot 38: Concrete pavement ( 10 inch)( fast track)
Lot 39: Geogrid pavement reinforcement
Lot 40: 18 inch rcp ( cip)
Lot 41: 24 inch rcp ( cip)
Lot 42: 18 inch rces ( spec)
Lot 43: 4 inch plastic pipe
Lot 44: Inlet type r l 10 ( 5 foot)
Lot 45: Inlet type r l 15 ( 5 foot)
Lot 46: Inlet spec ( trench)( 4 inch)
Lot 47: Manhole slab base ( 5 foot)
Lot 48: Concrete sidewalk ( 6 inch)
Lot 49: Concrete curb ramp
Lot 50: Curb type 2 ( section b)
Lot 51: Curb and gutter type 2 ( section i- b)
Lot 52: Curb and gutter type 2 ( section ii- b)
Lot 53: Gutter type 2 ( 8 foot)
Lot 54: Median cover material ( 4- inch patterned concrete) ( colored)
Lot 55: Delineator ( type 3)
Lot 56: 2 inch electrical conduit
Lot 57: 2 inch electrical conduit ( special)
Lot 58: Electrical system modifications
Lot 59: Wiring
Lot 60: Sign panel ( class i)( special)
Lot 61: Sign panel ( class i)
Lot 62: Steel signpost ( 2x2 inch tubing)
Lot 63: Steel sign support ( 2- 1/2 in round sch 80)( post & slipbase)
Lot 64: Traffic signal face ( 12- 12- 12)
Lot 65: Pedestrian push button pole
Lot 66: Pedestrian detector
Lot 67: Sanitary facility
Lot 68: Construction surveying
Lot 69: Mobilization
Lot 70: Modified epoxy pavement marking
Lot 71: Pavement marking paint ( high build)
Lot 72: Preformed plastic pavement marking ( type ii)( inlaid)
Lot 73: Preformed thermoplastic pavement marking ( word- symbol) ( inlaid)
Lot 74: Preformed thermoplastic pavement marking ( xwalk- stopline) ( inlaid)
Lot 75: Uniformed traffic control
Lot 76: Uniformed traffic control ( special)
Lot 77: Traffic control ( special) ls
Lot 78: Portable message sign panel
Lot 79: Description Price 700- ****
Lot 80: F/a minor contract revisions
Lot 81: F/a landscaping
Lot 82: F/a erosion control
Lot 83: F/a modify inlet
****- Acrovyn Handrail and End Cap - 5. PROJECT NUMBER ( if applicable) CODE 7. ADMINISTERED BY 2. AMENDMENT/MODIFICATION
Acrovyn handrail and end caps 10, 000 ft of Acrovyn **** woodgrain brushed metal patterned handrail model HRB 4CPN, blunt shaped profile, with 1 1/2 grip surface and 5 1/2 face, including quick lock mounting system, color **** Burmese Teak. All covers, recycled bumpers, and aluminum retainers for Acrovyn handrail models up to maximum 10 length. 600 each of Acrovyn **** woodgrain brushed metal patterned end cap for model HRB 4CPN, color **** Burmese Teak.
Bid Close Date:
Dry etching of Combined Gallium Nitride Epitaxial Layer and Silicon Carbide Substrate - See the attached SOW. All correspondence should reference ID# to ensure visibility. * PLEASE NOTE* THIS IS NOT A REQUEST FOR QUOTES. ANY PRICE OFFERS RECIEVED WILL NOT BE REVIEWED /ACCEPTED AT THIS TIM
Dry etching of gallium nitride epitaxial layer and silicon carbide substrate Lot 1: Fabrication of a 3- inch, 350- micron thick single crystal 4H- SiC wafer with a patterned nickel etch mask. Etching the wafer to 280 microns to a diaphragm of approximately 70 microns thickness. Diaphragm radii from 300 to 900 microns. Achieving a smooth diaphragm with fewer than 5 micro mask artifacts on each etched diaphragm surface. Diaphragm thickness uniformity across the wafer of +/- 5% of 70 microns. Achieving smooth diaphragm features free of scallops. Reasonable radius at the intersection of the diaphragm base with the sidewall, without notching. No edgewall trenching artifacts at the intersection of the diaphragm base and sidewall. Aspect ratio ( etched depth/etched width) no less than 5, higher aspect ratio preferred. Dry etching the top side pGaN to 3 m SiO2 etch mask to expose the 4H- SiC surface. Confirming etched depth to be 3 microns. Lot 2: Solvent cleaning of the wafer in acetone, followed by isopropanol. De
Bid Close Date:
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