Das105000 General Services Division Lzrs - OH
Shrink Wrap Machine/ Packaging Machinery/ Shrink Wrapping System
**** Combo, Fully Automatic L Sealer and Tunnel Combination Machine
Bid Close Date:
Government bid alerts, regional filters, and fast access to documents
Shrink Wrap Machine/ Packaging Machinery/ Shrink Wrapping System
**** Combo, Fully Automatic L Sealer and Tunnel Combination Machine
Bid Close Date:
Horizontal Wrapping Machine
Horizontal Overwrap Machine
Bid Close Date:
Pallet wrapping machine with **** pound capacity. - Pallet wrapping machine with **** pound capacity. Amended close date to 18 Sept.
Bid Close Date:
Packaging Machinery
Semiconductor Die Bonding and Vacuum Packaging System - This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13. 5 for Semiconductor Die Bonding and Vaccuum Packaging System.
semiconductor die bonding and vacuum packaging system semiconductor die bonding and vacuum packaging system, wrapping and packaging machinery
Pallet wrapping machine with **** pound capacity. - Pallet wrapping machine with **** pound capacity.
Bid Close Date:
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